Leading Edge Technologies


  • Fully automated 57,000 sq ft facility
  • Hybrid Technology boards.
  • Mixed Dielectric Construction.
  • 250 mils maximum board thickness.
  • 0.25 oz minimum and 5 oz maximum copper.
  • 4 mils traces & spacing (with 0.5 oz copper).
  • 5 mils annular ring and 9 mils clearance.
  • 6 mils finished hole.
  • 4 mils finish hole (Blind via) on up to 15 mils core.
  • 12 : 1 aspect ratio (Laminate thickness to drill hole).
  • 4 mils min. inner layer cores.
  • 0.5 mm SMT pitch & 0.8 mm BGA pitch.
  • 2 mils solder mask dams between SMT pads.
  • Controlled Impedance Modeling with TDR Testing.
  • Maximum panel size 21” x 26” (up to 6 layers) & 18” x 24” for the balance.