Products / Materials


 Products

 

 

  • Multi-layers up to 30 layers
  • Flex & Rigid-Flex
  • Blind / Buried via
  • High Performance Dielectric Technologies
  • Mixed Dielectric / Hybrid constructions
  • Controlled Impedance
  • Plasma Desmear / Etchback
  • Conductive & Non-conductive via fill
  • Carbon Paste
  • Selective Gold
  • Coloured Soldermask & Silkscreen
  • Vacuum, Moisture proof Packaging
  • CTI Job Tracking Software

 Materials

 

 Standard Materials

  • IS-402 (Tg 130 -140º C) –In stock.
  • FR-406 High-TG (Tg 170) –In stock
  • Polyimide (Tg 260 º C) –Selected stock.
  • BT Epoxy (G200) –Selected stock.

 High Frequency Materials

  • IS-408HR ( Tg 200 C )
  • IS-408 (Tg 180º C) –High Tg with low Dk (3.8) –Selected stock.
  • Nelco 4000-13 –High Tg with low Dk (3.8) –Special order.
  • Rogers 3000, 4000, 5000 & 6000 series. –Selected stock for 4000 & rest special order.
  • Arlon 25 series-Special stock for Redline
  • PTFE/ Teflon –Special order.
  • Taconic –Special order.

 Lead Free Materials

  • PCL 370HR (Tg 180º C)
  • IS-410 (Tg 180º C)
  • IS-410, Matsushita MEM 1755 and Nelco 4000-13 (High Tg) laminates.
  • These materials are phenolic based with high decomposition (Td) temperature.
  • Processes like regular FR-4 type materials
  • Better z-axis properties and low water absorption at higher temperatures gives better stability during high temperature lead free assembly.

  Note:
  a) All laminates being used at Circuit-tech are ROHS compliant.
  b) IS-410 is always in stock, MEM 1755 is limited stock and Nelco
      4000-13 is a special order.