Technology Roadmap


 Technology

Standard Tech

Leading Edge Tech

Future Tech

 Line Width / Space Phototool .004 /.0035 .003 /.003 .002 /.002
 Minimum Plated hole ( mech. Drill size ) .008 .006 .004
 Minimum Pad Diameter .018 .014 .010
 SMT pitch .020 .016 .015
 BGA pitch 1mm 0.8mm 0.5mm
 Plane clearance ( over drill size ) .018 .014 .01
 Aspect Ratio 10:1 12:1 14:1
 Maximum number of layers 20 24 30
 Minimum Web ( Dam ) .003 .002 .002
 Legend ( Line width ) 5 4 3
 Via Filling /  Conductive and Non-  Conductive Planarization 

No

Yes Yes
 Micro-via ( Blind/Buried ) Yes Yes Yes
 Micro Via Laser Drilling No No Yes
 Flex / Rigid - Flex No Yes Yes


 Material Requirements

Standard Tech

Leading Edge Tech

Future Tech

 Panel size ( max )

21 x 24

21 x 24

21 x 26

 Core thickness ( min )

.004

.0035

.003

 Panel thickness ( max )

.200

.250

.250

 Copper wt ( min )

H oz

¼ oz

¼ oz

 Copper wt ( max )

4 oz

4 oz

4 oz



 Temp Ratings

Standard Tech

Leading Edge Tech

Future Tech

 FR-4 140-150 Tg

Yes

Yes

Yes

 FR-4 170-180 Tg

Yes

Yes

Yes

 Polyimide 260 Tg

Yes

Yes

Yes

 BT Epoxy

Yes

Yes

Yes



 High Frequency

Standard Tech

Leading Edge Tech

Future Tech

 ( RoHS ) IS410/370 HR/MEM-1755

Yes

Yes

Yes

 Nelco N4000-13

Yes

Yes

Yes

 Rogers 4000 series

Yes

Yes

Yes

 Arlon 25 series

Yes

Yes

Yes

 Teflon

Yes

Yes

Yes

 Isola FR-408

Yes

Yes

Yes



 HDI Materials

Standard Tech

Leading Edge Tech

Future Tech

 Thermount

No

Yes

Yes

 RCC ( Resin Coated Copper Foil )

No

Yes

Yes

 CAF/Halogen Free

Yes

Yes

Yes

 Metal Core Bonding

No

Yes

Yes



 Finishes

Standard Tech

Leading Edge Tech

Future Tech

 Hot –Air-Solder-Level  ( HASL )

.0003

.0002

.0002

 Immersion Gold ( ROHS/Lead Free )

3 – 5 u inch

3 – 5 u inch

3 – 5 u inch

 Immersion Silver ( ROHS/Lead Free )

8 – 14 u inch

8 – 14 u inch

8 – 14 u inch

 Immersion Tin ( ROHS/Lead Free )

No

Yes

Yes

 Electrolytic Soft Gold

Outsource

30 u inch

30 u inch

 Electrolytic Hard Gold

Outsource

50 u inch

50 u inch

 Gold Tabs

30 – 50 u inch

30 – 50 u inch

30 – 50 u inch

 Lead Free HASL ( ROHS/Lead Free )

No

Yes

Yes



Soldermask

Standard Tech

Leading Edge Tech

Future Tech

 Minimum Web ( Dam )

.003

.002

.002

 Via Plug – Secondary Screen

Yes

Yes

Yes



Tolerances

Standard Tech

Leading Edge Tech

Future Tech

 Layer to Layer Registration

+/- .005

+/- .004

+/- .004

 Hole Locations

+/- .003

+/- .003

+/- .002

 Line Width ( Half ounce Copper )

+/- .001

+/- .0007

+/- .0005

 Board Thickness

+/- 10%

+/- 8%

+/- 6%

 Controlled Impedance

+/- 10%

+/- 10%

+/- 5%

 Warpage

.70%

.50%

.50%



Electrical Testing

Standard Tech

Leading Edge Tech

Future Tech

 Double Sided / Clamshell

.015 pitch

.015 pitch

.012 Pitch

 Flying Probe Tester

.006 Pitch

.006 Pitch

.004 Pitch